Light-Emitting Diodes for Non-Lighting Applications
~ beyond seeing and being seen ~
Prof. Shi-Wei Ricky LeeProfessor of Mechanical & Aerospace Engineering, HKUST
Director of Center for Advanced Microsystems Packaging
Director of HKUST LED-FPD Technology R&D Center at Foshan
rickylee@ust.hk
In the past decade, people witnessed more and more applications of light-emitting diodes (LED) for general lighting. There is no doubt that solid-state lighting has become commodity in the comercial markets. Many people are wondering about what next waves of LED R&D will be. Based on the speaker’s observation, there are three emerging areas worth noting, namely, UV-LED, visible light communications (VLC), and micro-LED display. All of these are for non-lighitng applications. This presentation will briefly touch on these emerging areas and then focus on UV-LED. The intention is to bring the on-going technology trends to the awareness of active researchers on LED so that they can put their resources and efforts on the hot spots. In addition to the fundamentals of UV-LED and relevant concerns in packaging, certain applications will be introduced to demonstrate the features of UV-LED which are diferente from conventional general lighting.
Biography
Ricky Lee received his PhD degree from Purdue University in 1992. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Dr Lee is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has a concurrent appointment as Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of 12 best/outstanding paper awards and 5 major professional society awards, Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and Institute of Physics (UK). He is also a Distinguished Lecturer and the Senior Past-President of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society.
Electronics Packaging Technology Conference 