Series of Hot Topics

EPTC 2016 bring out several hot topics in the industry.

3d-packaging-series

Through Silicon Vias (TSV) technology was adopted in production a few years ago for MEMS and CMOS Image Sensors (CIS). Driven by consumer applications such as smartphones and tablets, this market have grown over the last several years. 3DIC adoption & implementation has been seen for high-end memories (HBM/HBC) from 2014. Standards have now been established, the industry has grown in high-volume manufacturing. Wide I/Os,  logic-on-logic will follow, and Heterogeneous 3DIC nowadays is heating up. EPTC 2016 has lined up short courses on 3DIC integration / 3DIC Packaging & FA methods for 2.5D/3DIC and invited papers / speakers to present on the TSV / 3DIC  integration on Advanced technology node. Full details are in the subsequent pages. Download speaker line up here.

automotive-series

 

Autonomous driving, Clean & Green and connectivity & entertainment driving the growth of electronics contents in the automotive industry.  Many of the new functions requires new unique packaging requirements.   The new packaging needs extended hours at high temperature operation thus requires more robust materials, assembly processes and higher reliability compare to consumer products. Deeper temperature cycles in use case requires higher board-level reliability. EPTC 2016 have line up a keynote and an invited speakers to present on the automotive packaging.  Full details are in the subsequent pages. Download speakers line up here

china-series

In 2015, China imported nearly 70% of the world’s chips with about $230 billion dollars, which is more than the spend on crude oil. To change this situation, several plans, e.g. “Made in China 2025” (MIC 2025), were published by China’s State Council recently, to invest more than $100 billion in the semiconductor industry to reach its goal of playing a larger role in the global market. With the MIC 2025 plan, China is aiming to improve the self-sufficiency rate for ICs in the nation to 40% in 2020, and boost the rate further to 70% in 2025.

How these policies and investment will impact the current semiconductor industry? What’s the Opportunities & Challenges for the packaging community? EPTC has set up a panel session to explore the answers: “Rise of China Semiconductor”. There are also invited presentations to demonstrate current state-of-art of advanced packaging development in China. Download speakers line up here

 

iot-series

 

The Internet of Things (IoT) is the network of physical objects or “things” embedded with electronics, software, sensors, and network connectivity, which enables these objects to collect and exchange data. The size and cost of electronic components that are needed to support capabilities such as sensing, tracking and control mechanisms, play a critical role in the widespread adoption of IOT for various industry applications.  EPTC 2016 has lined up a keynote speaker, 2 PDC courses, and series of invited papers & presentations to present on the internet of things from packaging perspective. Full details are in the subsequent pages. Download speakers lineup here.

 

wlp-series

The mobile market is accelerating demand for more compact and complex semiconductor packages that are challenging traditional packaging technology in the areas of form factor, reliability and performance. This demand is driving the quick growth of conventional Fan-In wafer level packages (WLP), with estimated CAGR of 9% from 2014 to 2019. In another respect, the demand for high density interconnection, superior electrical performance and the ability to integrate multiple heterogeneous is driving the growth of new Fan-Out WLP, which is projected at CAGR of 87% from 2015 to 2020(from Techsearch)!

EPTC 2016 has lined up short courses on Fan-In Fan-Out WLP Packaging and 2 invited speakers to present on the advanced Fan-Out WLP. Full details are in the subsequent pages. Download speakers line up here

 

 

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