|Title :A Novel NanoCopper-Based Advanced Packaging Material|
|Invited Paper: Alfred A. Zinn|
|Affiliation: Advanced Technology Center, Lockheed Martin Corp.|
A novel nanocopper-based packaging material was developed for robust, void-free thermal interfaces between LEDs and heat sinks/spreaders and other high power components and devices allowing sub-10 micron thermal interfaces ensuring high heat transfer rates. Other applications are in TSV & wafer level packaging, embedded chip packaging, direct print of Si and Glass interposers, wafer level bonding and die attachment as well as printed and flexible electronics.
This solder-free nanocopper material overcomes the fundamental limitation of traditional solders, where the processing temperature sets an upper bound to the maximum possible operating temperature. Since nanocopper reverts to bulk copper upon fusion, it is capable of operating at temperatures above its original processing temperature making it the ideal high temperature packaging technology. Being pure copper in its fused state, the material can form contacts with 5-10x the thermal and electrical conductivity of typical solder systems. The material’s rheology can be tuned for drop-in replacement of solder paste on standard PCB assembly lines and other industrial dispensing and printing equipment. The resulting copper-based interconnects can exhibit improved creep resistance and enhanced reliability and robustness in low- and high-temperature operating environments.
For LED bonding to thermal heat sinks/spreaders, a readily dispensable nanocopper die attach material was formulated for controlled and repeatable dispensing of less than 0.1 mg per die that led to interface layers as thin as 2-3 micron.
Dr. Alfred Zinn has over 20 years of experience working on the development of nanostructured functional materials (optical, thermal, nano/micro-magnetics), smart materials, high-temperature materials systems, device physics modeling, quantum/ superlattice structures and devices, and high performance energy conversion devices (solar, high & low quality heat conversion). His role includes identifying profitable adjacencies and licensing opportunities for such new technologies and help bring them to market. His responsibility spans all phases of a project environment from the proposal phase, hardware design, analysis and testing, to technology transition and integration as well as commercialization. He has been leading multiple projects and teams to success at the ATC and is invaluable in the design, analysis, fabrication and test of materials systems. He has extensive experience in designing of complex materials systems for a wide variety of applications ranging from electronics to high temperature structural applications as well as manufacturing process design, implementation and scale-up.
Dr. Zinn currently holds 23 patents in materials, structures and processing technologies and THz technology, with over 10 additional patents pending (multiple international filings) as well as eight trade secrets and one trademark (CuantumFuseTM). He has authored or co-authored over 30 archival journal publications, including book chapters in “The Chemistry of Metal CVD” as well as the “Encyclopedia of Inorganic Chemistry.”