Wilmer R. Bottoms: Innovations in Packaging will enable the IoT world of the Future

Innovations in Packaging will enable the IoT world of the Future
Wilmer R. Bottoms, Ph.D
Third Millennium Test Solutions

Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density and cost threaten our ability to maintain the progress that has enabled the growth of our industry. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. It is clear that we will not have a replacement for the CMOS switch in the near term to return to a device scaling path to maintain the pace of progress. Only a revolution in packaging, which has not kept up with the scaling of CMOS, can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. These difficult challenges and potential solutions will be discussed.

 

 

Biography

Wilmer R. Bottoms, Ph.D

Dr.  Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of Several Companies both public and private.

Dr. Bottoms has also served in a number of Government Advisory positions including Chairman of the Board on Assessment for NIST and a member of the Technical Advisory Committee on export controls for the US Commerce Department.

Dr. Bottoms currently serves as:

  • Emeritus Member of the Board of Tulane University
  • Co-Chair of the Heterogeneous Integration Roadmap
  • Chairman of the SEMI’s Awards Committee
  • Chairman of the Packaging and Package Substrates Technical Working Group for INEMI
  • Member of the Board of MIT’s Microphotonic Center
  • Chairman of APMT
  • Chairman of Third Millennium Test Solutions