Rise of China Semiconductor
Topics: Semiconductor industry statistics and projections in China, Government policies, Supply chain, Semiconductor manufacturing and Packaging technologies, Opportunities & Challenges for China and for other countries/areas
Panel Chair/modulator : Prof. Zhu Wenhui (Suzhou Speed Semiconductor technology Co., Ltd.) Invited Panel List
- Tan Yong Tsong, Executive Director of IME (Singapore)
- Santosh Kumar, Senior Analysis of Yole Development (France)
- Bob Chylak, Senior Director of KnS (US)
- Kai Fai Ng, President of SEMI SEA (Singapore)
- Albert Lan, Senior Director of SPIL (Taiwan)
- Lung Chu,President of SEMI CHINA (China)
Dr. Wenhui Zhu is the CEO of Speed Suzhou Semiconductor Technology Pte Ltd. and professor of Central South University, China. He is the Chief Scientist of “Fundamental Research on Wafer-Level 3D Integration for 20/14nm ICs” which is the 1 st National Basic Research Program(973) in 3D IC integration. He was elected as Specially invited “1000 Elite Plan Expert(2011)” under top class Talent plan of China. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon，UTAC and TSHT. Dr. Zhu chaired many key projects in advanced packaging and structural integration such as national 863 project, Chinese natural science fund, and state key technology projects and made great achievements in technology innovation and cost-saving. He is a key player of international conferences, e.g. IEEE ICEPT(2008-now) and EPTC(2006-2009), as organization committee or technical committee chairman / co-chairman. Dr. Zhu is also reviewer of a few international journals in packaging areas. He has been invited to give keynote talks and short courses in international forums and conferences. Dr. Zhu has published more than 120 technical papers，owns 46 patents and won 3 times of best paper awards.
Dr Tan Yong Tsong joined A*STAR in August 2015 as Deputy Executive Director in the Science and Engineering Council (SERC), and was concurrently appointed as the Covering Executive Director of the Data Storage Institute (DSI). On 1 March 2016, Dr Tan was appointed as Deputy Executive Director of Institute of Microelectronics (IME) in addition to his current appointments. On 1 September 2016, Dr Tan assumed the appointment as Executive Director of Institute of Microelectronics (IME) whilst retaining his concurrent appointment of Covering Executive Director of Data Storage Institute (DSI), and relinquished his concurrent appointment of Deputy Executive Director of Science and Engineering Council (SERC). Dr Tan obtained his Bachelor degree from the National University of Singapore and took up a postgraduate scholarship from National Science and Technology Board (NSTB) to pursue his Master’s degree and PhD in Physics at the University of Cambridge. Dr Tan returned to Singapore upon completion of his studies abroad and joined the Institute of Microelectronics (IME) as a Senior Engineer and Business Development Leader. He left IME to join the private sector in 2003. Dr Tan has had more than 14 years of experience in technology management and investments, and business development in diverse industries including optical telecommunications, semiconductor components, renewable energy, medical imaging and diagnostics equipment. He has held various positions such as the Country Manager of Fujikura (Singapore), General Manager of FiberTech Ltd (China) and of Mitsui & Co. Ltd. (Japan).
Santosh Kumar is currently working as Senior Technology & Market Research Analyst at Yole Développement. He is involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging.
He received the bachelor and master degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
Bob Chylak is Vice President, Packaging and Process Integration for Kulicke & Soffa. He is responsible for the research and development of packaging solutions across all K&S products. Bob has more than 25 years of experience in the semiconductor industry. He has a BS-EE degree from Penn State University and completed Executive Management Studies at Stanford University. Bob has published more than 50 papers and holds numerous patents.
As President of SEMI Southeast Asia, Kai Fai Ng oversees the association’s programs, products, and services with the mission to develop the semiconductor industry within Southeast Asia along with regional partners and local SEMI members. Additionally, he supports SEMI international programs for members worldwide that have interests in Southeast Asian markets for technology and materials.
Ng has more than 17 years industry experience, primarily in semiconductor fabrication, R&D, and strategic planning. Prior to joining SEMI, he held several executive and financial management positions at Axcelis Technologies, KLA-Tencor, and Chartered Semiconductor.
Ng holds three US patents related to semiconductor technologies and processes, as well as an MBA from Macquarie University, Australia.
Albert Lan, Master of industrial & mechanical engineering department, Univ. of Wisconsin, Madison. Over 20 years of job experience on semiconductor industry, especially focus on bumping and flip chip advanced assembly technology. Vice Chairman of Semiconductor Equipment and Materials International Taiwan Association.Chairman of TILA (Taiwan Intelligent Leader Association). Currently Senior Director of Engineering Center of SPIL (Siliconware, Taiwan), which is 3rd biggest assembly house in the world.
As the President of SEMI China, Lung Chu oversees the evolution of SEMI’s programs, committees, products, and services to deliver the highest member value in China’s rapidly changing semiconductor ecosystem.
Most recently, Chu was President of China Operations for Global Unichip. He has also served as APAC President at Cadence Design Systems and Magma Design Automation, and held executive positions at KLA-Tencor, Apple Computer, and Philips Semiconductor. With more than 30 years of experience in semiconductor equipment, IC design, EDA/IP, semiconductor manufacturing, and system integration, Chu is uniquely suited to lead SEMI China and deliver on the SEMI 2020 Vision to increase collaboration across the entire manufacturing supply chain.
Chu holds a BSEE from National Taiwan University, an MSEE from Case Western Reserve University, and an MSEE and MBA from California State University. Additionally, he has served as President and Chairman of the Chinese American Semiconductor Professional Organization and currently heads its Shanghai and Hsinchu chapters.