Heterogeneous Integration Roadmap Workshop, December 2nd, 2016

Heterogeneous Integration Roadmap Workshop

Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. We now face new challenges with the slowing of Moore’s Law, the migration o to the Cloud, smart devices everywhere, and Internet of Things to Inbternet of Everything. While the pace of innovation is increasing to meet these challenges, the crucial question is will be the winning directions going forward?

The Heterogeneous Integration Roadmap (HIR), initialed by the IEEE CPMT Society ,and joined with IEEE EDS and Photonics Socidties and SEMI, will follow directly the purpose, process and format of the ITRS Heterogeneous Integration Roadmap (last ITRS 2.0 edition published on July 8th 2016)  for the 15-year assessment of  future requirements. This Heterogeneous Integration Roadmap  will continue the ITRS Heterogeneous Integration and Assembly and Packaging roadmapping workshops held in previous years at ESTC and other CPMT Conferences, while expanding the vision to address the major changes in the market place, and the disruptive changes in technology and the industry.   We invite  EPTC participants to attend this important working session for our profession, our industry and our research community.

Instructor’s Biography

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William Chen (Bill) currently holds the position of ASE Fellow and Senior Technical Advisor at ASE Group. Prior to joining ASE, he was the Director at the Institute of Materials Research & Engineering in Singapore. Bill retired from IBM Corporation after a career spanning over thirty years in various R&D and managerial positions. He has held adjunct and visiting faculty positions at Cornell University, Hong Kong University of Science and Technology, and Binghamton University. Bill is the chair of the newly formed Heterogeneous Integration Technology Roadmap for Semiconductors, an initiative addressing technologies for the IoT, IoE and cloud computing era,  jointly sponsored by IEEE CPMT, SEMI and EDS.  He also chairs SEMI’s Advanced Packaging Committee. In 2009, Bill received the InterPACK Excellence Award for his contributions, and in 2010, he was presented with the IEEE CPMT Society David Feldman Outstanding Contribution Award. He is a past President of the IEEE CPMT Society and he has been elected a Fellow of IEEE and a Fellow of ASME. Bill received B. Sc. from London University, M.Sc. from Brown University and Ph.D. from Cornell University.

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Wilmer R. Bottoms, Ph.D

Dr.  Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of Several Companies both public and private.

Dr. Bottoms has also served in a number of Government Advisory positions including Chairman of the Board on Assessment for NIST and a member of the Technical Advisory Committee on export controls for the US Commerce Department.

Dr. Bottoms currently serves as:

  • Emeritus Member of the Board of Tulane University
  • Co-Chair of the Heterogeneous Integration Roadmap
  • Chairman of the SEMI’s Awards Committee
  • Chairman of the Packaging and Package Substrates Technical Working Group for INEMI
  • Member of the Board of MIT’s Microphotonic Center
  • Chairman of APMT
  • Chairman of Third Millennium Test Solutions

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