|Title : 3D-Printing and electronic packaging: Current status and future challenges|
|Invited Presentation: Prof. Christopher Bailey
|Affiliation: University of Greenwich London, UK|
Achieving required performance, quality and reliability are key factors for the success and adoption of 3D printing technology in electronics manufacturing applications. This presentation details the current status of 3D-Printing with regards different processes and technologies and their potential use for electronics manufacturing and packaging. In addition to this, design, modelling methodologies, and toolsets for 3D-printing will be presented. These technologies provide significant benefits to packaging engineers in term sof optimizing the performance of the 3D-prining process and the quality and reliability of the fabricated packages. The presentation will then provide a summary of the key challenges that need to be overcome before 3D-printing can become a mainstream technology in the electronics industry
Professor Chris Bailey received his PhD in Computational Modelling in 1988 from University of Greenwich, and an MBA in Technology Management from the Open University in 1996. Before re-joining Greenwich in 1991, he worked for three years at Carnegie Mellon University and US Steel Corporation in Pittsburgh PA. He has been active in electronic packaging and its reliability for over 20 years. He currently leads the Computational Mechanics and Reliability Group at Greenwich and a research team of 15 staff whose work is primarily funded from UK, EU and US Government Organisations and Industry. His research has resulted in over 250 publications. He is an Associate Editor for the IEEE-CPMT Transactions; a Senior Member of IEEE, Member of IET and is currently Vice-President for conferences for IEEE-CPMT society.