|Title :In the IoT Development: How to Address Mechanical and Thermal Issue?|
|Invited Presentation: Sebastien Gallois-Garreignot|
Previous years have seen tremendous surge of interest and publications in the Internet of Things (IoT). Generally speaking, IoT may be defined as a global infrastructure connecting virtual and physical generic objects, collecting & exploiting information provided by those objects, and its related network developments. Numerous visions co-exist in the industry for that domain. The very wide range of possible applications (Transportation, Healthcare, Home/Office/Plant environments…) clearly promotes this technology as a real business opportunity in the coming years. In that regard, STMicroelectronics has developed a unique portfolio covering all the necessary building blocks (Analog, Connectivity, Microcontrollers, Power, Sensors…) able to provide solutions to create smart things.
In our analysis, IoT technologies rely on a strong heterogeneous integration, connectivity standards, large bandwidths and low power consumption… Moreover, the fields of application are as numerous as they are challenging. Indeed, the environments may be harsh and quite different from one to another: Automotive, Industry… Reliability may be also crucial like in e-Health domain. In that context, co-design is needed to propose reliable, optimized and efficient object. Focusing on the mechanical and thermal issues, these aspects have to be evaluated and controlled as soon as possible during the product development.
To do so, a traditional approach, based on Finite Element method, is necessary. Such tool may be considered as a good compromise between standardization/availability on the market, user-friendly interface and accuracy. However, the scale of interest (from millimeter to microns, and even nanometer) is a huge challenge which requires additional approaches.
Experimental characterization (properties, imaging, strain/temperature map…) is complex in our industry due to strong constraints: thin film effect, sample processing and micrometer scale are part of it. However, we have at our disposal very well-known electronic devices which can be rethought as sensors (among others, diode, transistor, resistance). Thus, it provides in-situ measurements during the process flow and/or the product life. Such data are more than welcome for our community: for calibration (CAD tool) and qualification (product) purposes but also, as an important data bank which may be used for further optimization, knowledge of the stress state in various applications.
In that sense, the parallel with the IoT (interactions and communications with the environment thanks to sensors embedded in everyday-life objects) is interesting and may be inspiring for developing new approach/methods for the reliability.
S. Gallois-Garreignot, P. Urard, V. Fiori, K. Ewuame, B. Vianne, C. Sart, A. Pic, I. Raid, R. Gonella
STMicroelectronics, 850 rue Jean Monnet, F-38926 Crolles cedex, France
Biography: Sebastien Gallois-Garreignot is in charge of mechanical and thermal simulations for STMicroelectronics, more particularly concerning the Chip/Package interactions and the related failures. Development of mechanical characterization methods, understanding of the fracture phenomena in complex architecture are ones of his additional fields of research and expertise.
He received Phd degree from INSA-Lyon on the experimental and numerical investigations on the fracture phenomena in advanced architecture in microelectronics in 2010.