PDC: Nanotechnologies for Microelectronics Packaging Applications: Current trends in IoT, Wearable, 3D, Flex Circuits, Thermal and Embedded passives

Title : Nanotechnologies for Microelectronics Packaging Applications:
Current trends in IoT, Wearable, 3D, Flex Circuits, Thermal and Embedded passives
JamesMorris
Course Leader: James E. Morris
Affiliation: Portland State University, USA

Course description:

Abstract
The course begins with an introduction to electronics packaging for context, which includes the current trends in IoT, wearable, 3D, flex circuits, thermal and embedded passives. It then focuses on the application of nanoparticle and CNT properties to the enhancement of packaging materials for reliability, e.g. by melting-point depression, sintering, Coulomb blocks, enhanced chemical activities, high mechanical strength, low ballistic resistance, etc. At the same time it will discuss applications of nanowires and other nanoscale structures.

  1. Introduction to Electronics Packaging and current trends: IoT, flex circuits, wearables, 3D thermal, embedded passives, etc.
  2.  Introduction to Nanotechnologies in Electronics Packaging
  3. Nanoparticle properties: melting point depression, coulomb block, sintering, optical, etc
  4. Nanoparticle fabrication
  5. Nanoparticles for high-k dielectric capacitors and resistors for embedded passives
  6. Nanogranular magnetic core inductors for embedded passives
  7. Nanoparticles in electrically conductive adhesives,
  8. Nanoparticles in microvias and conductive inks for SMT interconnect
  9. Nanoparticles added to lead-free solders and flip-chip underfills
  10. CNTs: fabrication, characterization (chirality, etc), and properties
  11. CNT effects in solders
  12. CNTs for thermal management and electromagnetic shielding
  13. Graphene for thermal management
  14. Nanowires and nanoscale spring interconnects
  15. Current commercial applications of nanopackaging
  16. Nanoscale modeling and simulation
  17. Summary

The course will be beneficial to electrical, mechanical, and materials engineers alike, or anyone with an interest in electronic device design, fabrication, assembly, or application. The level will be introductory, and accessible to students and graduates in any of these areas or the physical sciences.

Short Biography

James E. Morris
Department of Electrical & Computer Engineering,
Portland State University, Portland, OR 97207-0751, USA

Jim is a Professor Emeritus of Electrical & Computer Engineering at Portland State University, Oregon, and at the State University of New York at Binghamton.  His B.Sc. and 1st Class Honors M.Sc. degrees in Physics are from the University of Auckland, New Zealand, and his Ph.D. in Electrical Engineering is from the University of Saskatchewan, Canada.  He has served as Department Chair at both Binghamton and Portland, and was the founding Director of Binghamton’s Institute for Research in Electronics Packaging. Jim has also held faculty positions at Saskatchewan, Victoria University of Wellington (NZ), and South Dakota School of Mines & Technology, with visiting/sabbatical positions at Loughborough University (UK) as a Royal Academy of Engineering Distinguished Visiting Fellow, Chemnitz University of Technology (Germany), University of Maryland (USA), University of Bordeaux (France), University of Greenwich (London), Chalmers University of Technology (Sweden), Dresden University of Technology, University of Canterbury (NZ) as an Erskine Fellow, and Helsinki University of Technology as a Nokia-Fulbright Fellow, with honorary appointments at Shanghai University and Shanghai Jiao Tong University. Other positions have included Senior Technician and Post-Doctoral Fellow at the U of S, brief periods with Delphi Engineering (NZ) and IBM-Endicott (New York), and industrial consulting. He was recognized in 2015 with an honorary doctorate from the POLITEHNICA University of Bucharest.

Jim is an IEEE Fellow and an IEEE Components, Packaging, & Manufacturing (CPMT) Society Distinguished Lecturer. He has served as CPMT Treasurer (1991-1997) and Vice-President for Conferences (1998-2003), and currently sits on the CPMT Board of Governors (1996-1998, 2011-2016) and on the joint Oregon CAS/CPMT Chapter executive committee, and chairs the CPMT Nanotechnology technical committee. He was awarded the IEEE Millennium Medal and won the CPMT David Feldman Outstanding Contribution Award in 2005. He is an Associate-Editor of the IEEE CPMT Transactions and has been General Chair of three CPMT-sponsored conferences, Treasurer or Technical Chair of others, and serves on several CPMT conference committees. As the CPMT Society representative on the IEEE Nanotechnology Council (NTC), he instituted a regular Nanopackaging series of articles in the IEEE Nanotechnology Magazine, established the NTC Nanopackaging technical committee, (which also acts as a program committee for annual IEEE NANO conferences,) served as the 2010-2012 NTC Awards Chair, chaired the IEEE NANO 2011 conference in Portland, and served as NTC Vice-President for Conferences (2013-2014) and currently as Vice-President for Finance. He also co-founded the Oregon Chapter of the IEEE Education Society in 2005 and sits on its executive committee, and was Program Chair for the 1st and 2nd IEEE Conferences on Technology for Sustainability (2013/14).

His research activities are focused on electrically conductive adhesives, the electrical conduction mechanisms in discontinuous nanoparticle thin metal films, with applications to nanopackaging and single-electron transistor nanoelectronics, and on an NSF-funded project in undergraduate nanotechnology education. He has edited or co-authored five books on electronics packaging and two on nanodevices, and lectures internationally on nanopackaging and electrically conductive adhesives. He is currently putting together the expanded second edition of his book: “Nanopackaging: Nanotechnologies and Electronics packaging” (Springer, 2016.).