| Title :Technology and Business trends in Advanced Packaging |  |
| Invited Presentation: Damo Srinivas |
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| Affiliation: Managing Director, Business Development
Electrofill Business Unit Lam Research Corporation. |
The presentation will focus on technology and business trends in packaging. Market segmentation for current and emerging markets will be presented. The drivers and technology roadmap will be covered for DRAM and CIS market segments. Also, presented will be market size for capital equipment in the packaging segment. Increasing number of WLP in smart phones and other applications will continue to drive the growth of advanced packaging in OSAT and IDMs. Internet of Things (IoT) will enable further growth in the advanced packaging segment.
Biography
Damo Srinivas rejoined Novellus Systems Inc. in April 2010 and is currently Managing Director of Business Development for the Lam Research equipment portfolio serving the advanced wafer level packaging applications & FEOL Electroplating. Damo has held several key management positions including Vice President, General Manager for the Photoresist and CM business groups at Novellus and Vice President, Interconnect Technologies at ATMI Inc.
Damo has also extensive international customer experience working in account management roles for Novellus serving Intel in Hillsboro, OR for 6 years , IBM and alliance partners for 2 years based in Fishkill, NY and 2 years in Hsinchu, Taiwan R.O.C., serving TSMC, UMC, and the rest of the Semiconductor companies based in Taiwan, China and Singapore.
Damo also has extensive product management and business development experience and has led several new product development for high end value added Semiconductor applications. Damo received his M.S. Degree in Materials Science fromArizona State University, Tempe, AZ USA and B.S. Degree in Metallurgical Engineering from Indian Institute of Technology, Chennai, India.
Electronics Packaging Technology Conference 