Paul D. Franzon: 2.5D- and 3D-Stacked ICs

Title : 2.5D- and 3D-Stacked ICs paulfranzon.png
Course Leader: Paul Franzon
Affiliation: North Carolina State University, USA

Course description:

Three dimensional chips stacked using Through Silicon Via (TSV) technology has been under consideration and the subject of intensive research for several years now.    This tutorial covers the technology, applications, design and CAD for 3DIC.  The technology will be introduced, including TSVs, face to face technologies, integration options and interposers.  Applications will be discussed as driven by cost, performance and power efficiency needs.  Examples will be given from the commercial world and the author’s own research.  CAD and CAD-driven design will be covered including verification, test, and thermal evaluation.

Outline

  1. 3DIC Motivation
    • Power Efficiency
    • Memory Bandwidth
    • Bandwidth density
    • Heterogeneous Integration
    • Cost reduction
  2. 3DIC Manufacturing
    • Bulk TSV formation
    • SOI TSV formation
    • Wafer and chip assembly flows
    • Interposers
  3. 3DIC Design and Test
    • Power and power efficiency
    • Memories and memory interfaces
    • The potential for logic partitioning
    • CAD flows
    • Thermal design
    • Power delivery
  4. Test
    • Test issues
    • Potential Test Flows
    • Test standards
    • Cost issues
  5. Conclusions and Future perspectives

Bio

Paul D. Franzon is currently a Distinguished Professor of Electrical and Computer Engineering at North Carolina State University.  He earned his Ph.D. from the University of Adelaide, Adelaide, Australia.  He has also worked at AT&T Bell Laboratories, DSTO Australia, Australia Telecom and three companies he cofounded,  Communica, LightSpin Technologies and PBI Inc. His current interests center on the technology and design of complex microsystems incorporating VLSI, MEMS, advanced packaging and nano-electronics. He has lead several major efforts and published over 200 papers in these areas.  In 1993 he received an NSF Young Investigators Award, in 2001 was selected to join the NCSU Academy of Outstanding Teachers, in 2003, selected as a Distinguished Alumni Professor, and received the Alcoa Research Award in 2005.  He served with the Australian Army Reserve for 13 years as an Infantry Solider and Officer.  He is a Fellow of the IEEE.