TECHNICAL COMMITEE

T1 Advanced Packaging

Chair Navas KHAN NXP Semiconductor
Co-chair Rainer Dudek Fraunhofer ENAS
Member V.P GANESH Infineon Technologies
Member Aditya Kumar GLOBALFOUNDRIES
Member Jean-Charles SOURIAU LETI
Member Vempati SRINIVAS Institute of Microelectronics
Member C.S. Foong NXP Semiconductor
Member Bok Eng CHEAH Intel Microelectronics
Member KIM Hyoung Joon Samsung Electro-Mechanics (SEMCO)
Member Jatinder Kumar Semtech
Member Chris Bae Samsung
New Member Vasarla Nagendra Sekhar Institute of Microelectronics

T2: TSV/Wafer Level Packaging

Chair Dr. YOON Seung Wook Statschippac Pte LTD
Co-Chair Dr. Mark Huang Suzhou SPEED Semiconductor Technology Pte Ltd), China
Member Mr. Ranjan Rajoo Global Foundries, Singapore
Member Dr. CHEN Kuoming UMC, Taiwan
Member Dr. GAURAV Sharma Global Foundries, US
Member Mr. YANG Seung Taek SK Hynix Semiconductor, Korea
Member Mr. KIDA Tsuyoshi MGC, Japan
Member Dr. Lee Jaesik Oracle, US
Member Mr. JIN Yong Gang
Member Dr. Mingliang Huang Dalian University of Technology, China
Member Mr. John Hunt ASE, US
Member Dr. Jung Boo Yang IME, A*STAR Singapore
Member Mr. Thorsten Meyer Infineon AG, Germany
Member Mr. Yann Guillou Semi Europe
New Member Kroehnert Steffen Nanium, Portugal
New Member Mr. Santosh KUMAR Yole Development,France

T3: Interconnect Technologies

Chair David HUTT Loughborough University
Co-chair Liming SHEN Kulicke & Soffa, Singapore
Member Horst CLAUBERG KnS
Member Wei FAN Singapore Institute of Manufacturing Technology
Member Hong Meng HO STATS ChipPAC, Singapore
Member James HOW Singapore
Member Poi Siong TEO, Infineon Technologies Asia Pacific, Singapore
Member John LAU ASMT
Member Yew Cheong MUI Advanced Micro Devices, Singapore
Member Nga Phuong PHAM IMEC, Belgium
Member Daquan YU Chinese Academy of Science, China
Member Jack XIONG Qorvo, Singapore
New member Tanemasa ASANO Kyushu University
New member Kyung W. Paik KAIST

 

T4: Emerging Technologies

Chair Kripesh VAIDYANATHAN ITE, Singapore
Co-chair Martin OPPERMANN Dresden University of Technology
Member Perceval COUDRAIN STMicroelectronics
Member Andreas FIX Robert Bosch GmbH
Member Matthias HUTTER Fraunhofer Institute for Reliability and Microintegration
Member Toni MATTILA Aalto University Espoo
Member James E MORRIS Portland State University
Member Nga Phuong PHAM IMEC
Member Wolfgang REINERT Fraunhofer Institute for Silicon Technology
New member Thomas ZERNA Dresden University of Technology
New member Riko I Made Singapore MIT Alliance for Research and Technology
New member Yufeng Yao Broadcom Ltd (Avago Technologies)
New member Rama Krishna Kotlanka Analog Devices, USA

 

T5: Materials and Substrates/Leadframes

Chair Dr Chin Hock TOH Singapore
Co-chair Dr Won Kyoung CHOI STATS ChipPAC Ltd, Singapore
Member Prof. Robert GAO National Taiwan University, Taiwan
Member Jun DIMAANO United Test & Assembly Center Limited, Singapore
Member Prof. Chee Lip GAN Nanyang Technological University, Singapore
Member Prof. Sungdong KIM Seoul National University of Science & Technology, Korea
Member Dr Kim Shyong SIOW University Kebangsaan Malaysia, Malaysia
Member Alvin LEE Brewer Science, Taiwan
Member Prof. Changqing LIU Loughborough University, UK
Member Prof. Young-Bae PARK Andong National University, South Korea
Member Dr Lim Chong SIM Robert Bosch Sdn Bhd, Malaysia
Member Prof. Chuan Seng TAN Nanyang Technological University, Singapore
Member Bart VANDEVELDE IMEC, Belgium
Member Vempati Srinivasa RAO IME, Singapore
Member Dr Jun WEI Singapore Institute of Manufacturing Technology, Singapore
Member John OVISO PEP Innovation Pte Ltd, Singapore
Member Chin-Yu (Max) LU Siliconware Precision Industries Ltd, Taiwan
Member Dr Suan Hui PU University of Southampton, Malaysia
Member Chunte TU Accurus, Taiwan

 

T6: Electrical Modeling & Simulations

Chair Wui Weng Wong AMD
Co-chair Mihai Rotaru U. of Southampton, U.K.
Member Aoyagi Masahiro AIST, Japan
Member Weerasekera Roshan University of the West of England (UWE)
Member Xiang Yin Zeng Avago Technologies
Member Chee Parng Chua Jabil Circuit, Singapore
Member Engin Ege San Diego State University , USA
Member Fujiang Lin USTC, China
Member Jianyong Xie Intel Assembly & Test Techology Development (ATTD), Pheonix
Member Chetan Verma Freescale, India
Member Mattew Shajan Global Foundries, Singapore
Member Jackson Kong Intel, Malaysia

 

T7: Mechanical Modeling & Simulations

Chair Andrew TAY National University of Singapore, Singapore
Co-chair Shan GAO  GLOBALFOUNDRIES, USA
Member  Ephraim Suhir  Portland State University, USA
Member Daoguo Yang Guilin University of Electronic Technology, China
Member Suresh SITARAMAN Georgia Institute of Technology, USA
Member Kuo Ning CHIANG National Tsing Hua University,Taiwan
Member Leo ERNST Ernst Consultant
Member Yong LIU Fairchild, USA
Member Juergen Auersperg  Fraunhofer ENAS, Germany
Member Wei Zhou Micron, Singapore
Member Azhar Aripin On Semi, Malaysia
Member Eric Yong Infineon Technologies Asia Pacific, Singapore
Member Premachandran CS Globalfoundries
Member Xiaowu ZHANG Institute of Microelectronics,Singapore
Member Christopher Bailey University of Greenwich, UK
Member Rathin MANDAL Advanced Micro Devices Singapore, Singapore

 

T8: Thermal Characterization & Cooling Solutions

Chair Rathin MANDAL Advanced Micro Devices Singapore, Singapore
Co-chair Marta RENCZ Mentor Graphics – MicReD, Hungary
Member Wataru NAKAYAMA Therm Tech International, Japan
Member Yogendra JOSHI Georgia Institute of Technology, USA
Member Sandeep TONAPI Anveshak Technology and Knowledge Solutions, USA
Member Justin A. WEIBEL Purdue University, USA
Member Yong Jiun LEE CAD-IT Consultants (Asia) Pte Ltd, Singapore
Member Yong Sheng CHUA DSO National Laboratories, Singapore
Member Melvin TAN Siow Pin Continental Automotive Singapore Pte Ltd, Singapore
New member Edwin TEO Nanyang Technological University, Singapore
New member Hengyun ZHANG Shanghai University of Engineering Science, China
New member Marcin JANICKI Lodz University of Technology, Poland
New member Yong HAN Institute of Microelectronics (A-star), Singapore

 

T9: Quality & Reliability

Chair Alfred YEO Infineon, Singapore
Co-Chair Tong Yan TEE SMARTS Enterprise, Singapore
Member Christian BIRZER Infineon Technologies, Germany
Member Liqiang CAO Chinese Academy of Science, China
Member Xuejun FAN Lamar University , United States
Member Yi-Shao LAI ASE, Taiwan
Member Stefano MARIANI Politecnico di Milano, Italy
Member Keith NEWMAN Hewlett Packard, United States
Member Hong Wan NG Micron, Singapore
Member Shaw Fong WONG Intel, Malaysia
Member Chong Chin Hui Micron, Singapore

 

T10: Wafer/Package Level & TSV Testing & Characterization

Chair Bruce KIM, City University of New York
Co-chair Sang-Bock Cho University of Ulsan, South Korea
New member Prem Chahal Michigan State University
Member Sungho KANG Yonsei University, Korea
Member En-Xiao LIU Institute of High Performance Computing, Singapore
Member Dr. Sock-Ho Noh Andong National University; korea
Member Abhilash Goyal Oracle (Sun Microsystems) USA
Member Xiaoxiong Gu (Kevin) IBM T.J. Watson Research Center, NY, USA
Member Li Li Cisco Inc
Member Nanju Na IBM
Member Seungbae PARK The State University of New York at Binghamton
Member W. L. CHONG Advanced Micro Devices, Singapore
New Member Santosh Kumar Yole Développement

T11: Processes and Automation/Equipments:

Chair James How Singapore
Co-chair Dr He Yunbo Guangdong University of Technologies
New Member Lee, Chee Ping LAM Research
New Member Dr Xu Hui K&S
Transferred from TC5 Dr Loke Yuen WONG Applied Materials, Singapore