ADVANCE PROGRAM

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Wednesday, 30th November 2016

730-830hrs Registration
0830-1220hrs PDC 1 : Nanotechnologies for Microelectronics Packaging Applications PDC 2 : 3D Integrated Circuit Failure Analysis PDC 3 : Fan-In and Fan-Out in Wafer Level Packaging
MR300, Level 3 MR301, Level 3 MR302, Level 3
1220-1310hrs Lunch @ MR329
1310-1700hrs PDC 4 : Energy Efficient Thermal Management of Data Centers PDC 5 : Internet of Things (IoT) focusing on Wireless Sensors Network and Active RFID PDC 6 : 2.5D and 3D-Stacked Integrated Circuits
MR300, Level 3 MR301, Level 3 MR302, Level 3
1730-1900hrs Panel Speaker Presentation (Topic : Rise of China Semiconductor) @ MR 303-304, Level 3
1900-1930hrs Panel Q & A

Thursday, 1st December 2016

0730-0830hrs (60min) Registration @ Level 3(Secretariat Room)
0840hrs (10min) Welcome Speech (EPTC 2016 General Chair) @ MR331-332, Level 3 Mr Ranjan Rajoo
0840-0900hrs (20min) Opening Address @ MR331-332, Level 3 Jean M. TREWHELLA, IEEE CPMT President
0900-0930hrs (30min) Keynote address 1 @ MR331-332, Level 3 Tom Dolbear(AMD) : Packaging Matters
0930-1000hrs (30min) Keynote address 2 @ MR331-332, Level 3 Prof. Kanji Otsuka(Meisi Univ) : How to Feed Enough to Greedy IOT Monster
10:00-10:30 hr (30min) Coffee/Tea break @ Summit 2
1030-1100 hrs (30min) Keynote address 3 @ MR331-332, Level 3 Prof. Zhu Wenhui(Suzhou Speed Semiconductor Technology) : Advances of 3D Integration in China
1100-1130 hrs (30min) Keynote address 4 @ MR331-332, Level 3 Dr Bill Chen(ASE) : Innovation in SiP & Heterogeneous Integration
1130-1200 hrs (30min) Keynote address 5 @ MR331-332, Level 3 Jagadish CV(SSMC) : Achieving Automotive Quality Excellence : Zero Defect Performance – A foundry’s perspective
1200-1330hrs (90min) Lunch @ Summit 2
Luncheon Talk ( Jean Trewhella ) Presentation of EPTC 2015 Best Paper Awards
Presentation of IEEE CPMT Certification of Appreciation to EPTC 2016 Organizing Committee
1330-1400hrs (30min) Advanced MIS SIP technology Mr. YB Lin, JCET What’s happening in TSV based 3D/2.5D IC packaging: Latest market & technology trends Mr. Santosh Kumar, Yole Development Overview of latest assembly equipment developments for advanced packaging Bob Chylak, K&S Chip Integrated Single Phase Liquid Cooling Using Pin Fin Enhanced Microgaps Prof. Yogendra Joshi, Georgia Tech A Novel NanoCopper-Based Advanced Packaging Material Dr. Zinn, Alfred A Lockheed Martin Space Systems Company Innovations in Packaging will enable the IoT world of the Future Dr. Bill Bottoms, 3MTS
MR331 MR332 MR333 MR334 MR335 MR336
1400-1520hrs (80min) Session A1 Session A2 Session A3 Session A4 Session A5 Session A6
1 (20min) Paper ID : 26 Paper ID : 36 Paper ID : 15 Paper ID : 06 Paper ID : 58 Paper ID : 19
2 (20min) Paper ID : 08 Paper ID : 52 Paper ID : 170 Paper ID : 11 Paper ID : 59 Paper ID : 21
3 (20min) Paper ID : 25 Paper ID : 89 Paper ID : 41 Paper ID : 12 Paper ID : 127 Paper ID : 28
4 (20min) Paper ID : 07 Paper ID : 88 Paper ID : 47 Paper ID : 17 Paper ID : 80 Paper ID : 45
Room MR331 MR332 MR333 MR334 MR335 MR336
1520-1630hrs (70min) Coffee/Tea Break/ Exhibitor Presentation @ Summit 2

Lam Research : Partnering for Growth in Advanced Packaging, Mr. Lee Chee Ping

Indium Corporation : Materials for Advance Packaging, Ms. Sze Pei LIM

PacTech Asia Sdn. Bhd : PacTech Technology Introduction (commercial video)

SPIL : SPIL Innovative Package Solutions, Mr. Albert Lan

AMAT : Process and Equipment Technology for Advanced Packaging, Dr. Arvind SUNDARRAJAN

ASM : Solutions For Large Format Packaging, Mr. Eugene Wee

1630-1750hrs (80min) Session B1 Session B2 Session B3 Session B4 Session B5 Session B6
1 (20min) Paper ID : 16 Paper ID : 48 Paper ID : 09 Paper ID : 18 Paper ID : 63 Paper ID : 44
2 (20min) Paper ID : 38 Paper ID : 50 Paper ID : 74 Paper ID : 24 Paper ID : 75 Paper ID : 95
3 (20min) Paper ID : 43 Paper ID : 86 Paper ID : 161 Paper ID : 46 Paper ID : 107 Paper ID : 103
4 (20min) Paper ID : 65 Paper ID : 93 Paper ID : 134 Paper ID : 106 Paper ID : 112
Room MR331 MR332 MR333 MR334 MR335 MR336
1830-2230hrs Conference Banquet ( Venue : Prive@ CHIJMES )

Friday, 2nd December 2016

0830-0900hrs (30min) IOT: Constraints and Requirements for Packaging Technology Dr. Sebastien Gallois-garreignot, STM Laser Processing of Printed Copper Interconnects On Polymer Substrates Dr. David HUTT. Loughborough Univ. Package Miniaturization & Integration for Future Automotive Applications Mr. Andreas Fischer, Robert Bosch Packaging and Testing of High Speed Rotor for MEMS Gas Turbine Engines Prof. Xiaojun Yan, Beihang Univ. Technology and Market Trends in Packaging Mr. Damo Srinivas, Lam Research Wafer Bonding as an Enabler for Microsystems Packaging and Integration Prof. Tan Chuan Seng, NTU
Room MR331 MR332 MR333 MR334 MR335 MR336
0900-1000hrs (60min) Session C1 Session C2 Session C3 Session C4 Session C5 Session C6
1 (20min) Paper ID : 70 Paper ID : 82 Paper ID : 13 Paper ID : 85 Paper ID : 147 Paper ID : 117
2 (20min) Paper ID : 102 Paper ID : 108 Paper ID : 72 Paper ID : 143 Paper ID : 218 Paper ID : 221
3 (20min) Paper ID : 142 Paper ID : 61 Paper ID : 137 Paper ID : 145
Room MR331 MR332 MR333 MR334 MR335 MR336
1000-1110hrs (70min) Coffee/Tea Break/ Exhibition@ Summit 2

Upstar-SMART : INTEGRATED SOLUTION FOR YOUR BOARD LEVEL RELIABILITY NEEDS, Mr. CHUA ENG GUAN/NG HUN SHENG

Advisian : Realistic Simulation and Infinite Opportunities, Mr. Nishant Kumar

CST : Signal and Power Integrity Simulations in Packages and PCBs, Mr. Klaus Krohne Ulvac :

Nordson : X-ray Metrology “Measuring the Invisible”, Steve Hursey

CAD-IT : ANSYS Multiphysics Simulation for IoT, Dr. Lee Yong Jiun

AGC Asia Pacific Pte Ltd : “We are AGC !”, Ms. Jasmine Cheh

1110-1230hrs (80min) Session D1 Session D2 Session D3 Session D4 Session D5 Session D6
1 (20min) Paper ID : 201 Paper ID : 54 Paper ID : 55 Paper ID : 164 Paper ID : 144 Paper ID : 57
2 (20min) Paper ID : 236 Paper ID : 104 Paper ID : 56 Paper ID : 167 Paper ID : 180 Paper ID : 64
3 (20min) Paper ID : 33 Paper ID : 116 Paper ID : 100 Paper ID : 71 Paper ID : 209 Paper ID : 76
4 (20min) Paper ID : 35 Paper ID : 120 Paper ID : 125 Paper ID : 173 Paper ID : 119 Paper ID : 101
Room MR331 MR332 MR333 MR334 MR335 MR336
1230-1340 hrs (70min) Lunch @ Summit 2
Presentation of Appreciation to Invited Papers’ Authors
18th Electronic Packaging Technology Conference Organisation Committee Appreciation
19th Electronic Packaging Technology Conference Introduction
1340-1410hrs (30min) Enabling Design for Reliability in Advanced Interconnects for 3D IC and Next Generation Solar PV (Photovoltaics) Systems Prof. Arief Budiman, SUTD Multi-die integration using advanced fan-out packaging technology Mr. WonChul Do, Amkor Materials and Processes of Fan-out Wafer/Panel Level Packaging Dr. Li Ming, ASM 3D-PRINTING AND ELECTRONIC PACKAGING: CURRENT STATUS AND FUTURE CHALLENGES Prof. Christopher Bailey, University of Greenwich Patent MonetizationMr. Dexter Chin, Horizon IP Pte Ltd Advanced Devices Packaging Technologies for High Dense Power Converter in More Electric Aircraft Application Dr. Rejeki Simanjorang, Rolls Royce
Room MR331 MR332 MR333 MR334 MR335 MR336
1410 – 1530 hrs (80 min) Session E1 Session E2 Session E3 Session E4 Session E5 Session E6
1 (20min) Paper ID : 129 Paper ID : 122 Paper ID : 157 Paper ID : 78 Paper ID : 224 Paper ID : 136
2 (20min) Paper ID : 133 Paper ID : 156 Paper ID : 160 Paper ID : 178 Paper ID : 96 Paper ID : 158
3 (20min) Paper ID : 211 Paper ID : 185 Paper ID : 225 Paper ID : 190 Paper ID : 223 Paper ID : 184
4 (20min) Paper ID : 148 Paper ID : 212 Paper ID : 237 Paper ID : 188 Paper ID : 227
Room MR331 MR332 MR333 MR334 MR335 MR336
1530-1600hrs (30min) Coffee/Tea Break/ Exhibition@ Summit 2
1600-1720hrs (80 min) Session F1 Session F2 Session F3 Session F4 Session F5 IEEE CPMT PKG Roadmap Workshop
1 (20min) Paper ID : 194 Paper ID : 195 Paper ID : 172 Paper ID: 140 Paper ID : 66
2 (20min) Paper ID : 202 Paper ID : 233 Paper ID : 111 Paper ID: 99 Paper ID : 114
3 (20min) Paper ID : 208 Paper ID : 205 Paper ID : 189 Paper ID: 200 Paper ID : 109
4 (20min) Paper ID : 168 Paper ID : 191 Paper ID : 135 Paper ID: 146
Room MR332 MR333 MR334 MR335 MR336 MR331
1720-1750 hrs (30min) Keynote address 6 @ Summit 2 Prof. Ricky SW Lee, Hong Kong Univ. Science & Technology : Light-Emitting Diodes for Non-Lighting Applications ~ beyond seeing and being seen ~
1750-1810 (20min) Closing Ceremony and Lucky Draw @ Summit 2

Saturday, 3rd December 2016

SUTD(Singapore University of Technology and Design) Visit to ( 3D fabrication lab / International Design Centre / Jackie Chan Ancient Chinese Structures)

floor-plan

No. Room Program
1 MR331 Keynote / Technical Track 1
2 MR332 Keynote / Technical Track 2
3 MR333 Technical Track 3
4 MR334 Technical Track 4
5 MR335 Technical Track 5
6 MR336 Technical Track 6
7 Foyer 5 Exhibition & Registration
8 MR330 Conference Secretariat
9 MR329 PDC lunch
10 Summit 2 Conference Luncheon
11 MR300 PDC1 & PDC4
12 MR301 PDC2 & PDC5
13 MR302 PDC3 & PDC6
14 MR303-304 Panel session