EPTC 2016 Professional Development Course

Course Leader: James E. Morris
Title : Nanotechnologies for Microelectronics Packaging Applications:
Current trends in IoT, Wearable, 3D, Flex Circuits, Thermal and Embedded passives
Affiliation: James E. Morris, Portland State University, USA
Course description:




Course Leader: Ingrid De Wolf, Prof.
Title : 3D Integrated Circuits Failure Analysis
Affiliation: IMEC, Belgium & KULeuven, Belgium
Course description:





Course Leader: Albert Lan
Title : Fan-In and Fan-Out in Wafer Level Packaging
Affiliation: SPIL, Taiwan
Course description:



Course Leader: Yogendra Joshi
Title : Energy Efficient Thermal Management of Data Centers
Affiliation: Georgia Tech, USA
Course description:




Course Leader: Holden Li
Title : Internet of Things (IoT) focusing on Wireless Sensors Network and Active RFID
Affiliation: Tamasek Laboratories at Nanyang Technological University, Singapore
Course description:





Course Leader: Paul D. Franzon
Title : 2.5D- and 3D-Stacked Integrated Circuits
Affiliation: North Carolina State University, USA
Course description:




Download PDF

2 thoughts on “EPTC 2016 Professional Development Course

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Google photo

You are commenting using your Google account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s