EPTC 2016: Speaker Update, Dr Rejeki Simanjorang will talk about Advance Packaging Requirement for Power Semiconductor Module

Dr Rejeki Simanjorang will talk about: Requirement for Advanced-Packaging Technology of Power Semiconductor Module in High Power Density Converter for More Electric Transportation. His presentation will elaborate the electrical performances of power module required for high speed switching in high power density converter. Parasitic impedance in power module that originates from devices and packaging layout will be discussed. Their effects to the power converters such as overshoot voltage, EMI issues, and switching loss will be elaborated. Finally, advanced packaging technique to minimize these parasitic impedances will be presented. More detail description can be found here

 

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